DIE ATTACH

Part #
Description
DATASHEET
MSDS
2900 Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
2900
2900-MSDS
2900LV Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
2900LV
2900LV-MSDS
2920 New Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life.
2920
2920-MSDS
2948 Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.
2948
2948-MSDS
2990 Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.
2990
2990-MSDS
6158 Flexible, dielectric, semiconductor grade adhesive. Low stress, 8 hr work life, low extractable ions.
6158
6158-MSDS
6959 Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175°C.
6959
6959-MSDS