DISK DRIVE

Part #
Description
DATASHEET
MSDS
2120 Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.
2120
2120-MSDS
2121 Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.
2121
2121-MSDS
6175 Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.
6175
6175-MSDS
6250 Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.
6250
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6460 Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.
6460
6460-MSDS
6515 Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series
6515
6515-MSDS
6680 For use in wet coil winding
6680
6680-MSDS
6860 Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.
6860
6860-MSDS
6875 Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.
6875
6875-MSDS
6900 Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60°C / 80% R.H.
6900
6900-MSDS