MOISTURE RESISTANT

Part #
Description
DATASHEET
MSDS
2990 Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.
2900
2900-MSDS
6150 High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.
6150
6150-MSDS
6175 Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.
6175
6175-MSDS
6200 Offers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability.
6200
6200-MSDS
6577 Medium viscosity encapsulant / sealant, room temperature cure, good impact and thermal shock properties.
6577
6577-MSDS
7780 Moisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing.
7780
7780-MSDS
7784 Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130°C
7784
7784-MSDS
7995 Glob top adhesive. Chip-on-board encapsulant. High purity. Maximum moisture resistance. Low mobile ions, Tg=132°C
7995
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