STRUCTURAL BONDING

Part #
Description
DATASHEET
MSDS
6150 High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.
6150
6150-MSDS
6165 Structural adhesive, high peel strength, good for bonding dissimilar substrate
6165
6165-MSDS
6175 Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.
6175
6175-MSDS
6250 Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.
6250
-
6460 Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.
6460
6460-MSDS
6500 Rapid curing adhesive with a strong structural bond
6500
6500-MSDS
6501 Low outgassing, fast cure, epoxy adhesive
6501
6501-MSDS
6640 General purpose, room temperature cure epoxy adhesive / Medical grade
6640
6640-MSDS
7086 Structural adhesive that provides an excellent bond to metal surfaces.
7086
7086-MSDS
7352 Structural adhesive, with a long work life, that bonds well to metal, and other difficult surfaces.
7352
-
7355 Structural epoxy adhesive, good for sealing ceramic packages. Ceramic substrate attach. Excellent adhesion to gold, silver and copper. Tg=130°C.
7355
-