THERMALLY CONDUCTIVE

Part #
Description
DATASHEET
MSDS
7080 Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.
7080
7080-MSDS
7081 Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.
7081
7081-MSDS
7258 Thermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE.
7258
7258-MSDS
7784 Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130°C
7784
7784-MSDS
7794 Thermally conductive adhesive designed for bonding difficult surfaces.
7794
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