DIFFICULT-TO-BOND SURFACES

Part #
Description
DATASHEET
MSDS
2106 Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.
2106
2106-MSDS
2111 Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006" needle. Low temp. cure.
2111
2111-MSDS
6755 Low viscosity epoxy, offers high dimensional stability
6755
6755-MSDS
7352 Structural Adhesive, for difficult-to-bond materials. Long work life.
7352
-
7784 Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130°C
7784
7784-MSDS
7794 Thermally conductive adhesive designed for difficult to bond materials.
7794
-